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| MCP606/607/608/609 2.5V to 5.5V Micropower CMOS Op Amps FEATURES * * * * * * * * * * Low Power IDD = 25A, max Low Offset Voltage: 250V, max Rail-to-Rail Swing at Output 80pA, Low Input Bias Current over Temperature Specifications rated for 2.5V to 5.5V Supplies Unity Gain Stable Chip Select Capability with MCP608 Industrial Temperature range supported No Phase Reversal Available in Single, Dual, and Quad DESCRIPTION The MCP606, MCP607, MCP608 and MCP609 from Microchip Technology, Inc. are unity gain stable, low offset voltage operational amplifiers capable of precision low power single supply operation. Performance characteristics include ultra low offset voltage (250V, max), rail-to-rail output swing capability, and low input bias current (80pA@85C). These features make this family of amplifiers well suited for single supply precision, high impedance, battery powered applications. The single MCP606 is available in standard 8-lead PDIP, SOIC, and TSSOP packages. Another version of the single op amp, MCP608 is offered with a Chip Select option in standard 8-lead PDIP, SOIC, and TSSOP packages. The dual MCP607 is offered in standard 8-lead PDIP, SOIC, as well as the TSSOP package. Finally, the quad MCP609 is offered in 14-lead PDIP, SOIC and TSSOP packages. All devices are fully specified from -40 C to +85 C with power supplies from 2.5V to 5.5V. APPLICATIONS * Battery Power Instruments * High Impedance Applications - Photodiode Pre-amps - pH probe Buffer Amplifier - Infrared Detectors - Precision Integrators - Charge Amplifier for Piezoelectric Transducers * Strain Gauges * Medical Instruments * Test Equipment PACKAGES MCP606 PDIP, SOIC,TSSOP NC 1 -IN 2 + 8 NC 7 VDD 6 OUT 5 NC MCP607 PDIP, SOIC,TSSOP OUTA -IN +INA VSS 1 2 3 4 -+ +B A 8 VDD 7 OUT 6 -INB 5 +INB +IN 3 AVAILABLE TOOLS * Spice Macromodels (at www.microchip.com) * FilterLabTM Software (at www.microchip.com) (c) 2000 Microchip Technology Inc. VSS 4 MCP608 PDIP, SOIC,TSSOP NC 1 -IN 2 +IN 3 VSS 4 + 8 CS 7 VDD 6 OUT 5 NC MCP609 PDIP, SOIC,TSSOP OUTA 1 -INA 2 +INA 3 VDD 4 +INB 5 -INB 6 OUT1 7 -+ +B C A 14 OUTD - + +D - 13 -IND 12 +IND 11 VSS 10 +INC 9 -INC 8 OUTC 2000 Microchip Technology Inc. DS11177B-page 1 MCP606/607/608/609 1.0 1.1 ELECTRICAL CHARACTERISTICS Maximum Ratings* operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VDD ..................................................................................7.0V All inputs and outputs w.r.t. ............ VSS -0.3V to VDD +0.3V Difference Input voltage ....................................... |VDD - VSS| Output Short Circuit Current ..................................continuous Current at Input Pin .................................................... +/-2mA Current at Output and Supply Pins .......................... +/-30mA Storage temperature .....................................-65C to +150C Ambient temp. with power applied ................-55C to +125C Soldering temperature of leads (10 seconds) ............. +300C ESD protection on all pins .................................................. 2 kV *Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the PIN FUNCTION TABLE NAME +IN/+INA/+INB/+INC/+IND -IN/-INA/-INB/-INC/-IND VDD VSS CS NC FUNCTION Non-inverting Input Terminals Inverting Input Terminals Positive Power Supply Negative Power Supply Chip Select No internal connection to IC OUT/OUTA/OUTB/OUTC/OUTD Output Terminals DC CHARACTERISTICS Unless otherwise specified, all limits are specified for VDD = +2.5V to +5.5V, VSS = GND, TA = 25 C, VCM = VDD/2, RL = 100k to VDD/2, and VOUT ~ VDD/2 PARAMETERS INPUT OFFSET Input Offset Voltage Drift with Temperature, Power Supply Rejection INPUT BIAS CURRENT AND IMPEDANCE Input Bias Current Over Temperature Input Offset Bias Current Common Mode Input Impedance Differential Input Impedance COMMON MODE Common-Mode Input Range Common-Mode Rejection Ratio OPEN LOOP GAIN DC Open Loop Gain AOL 105 121 -- dB RL = 25k to GND, 50mV < VOUT < (VDD - 50mV) RL = 5k to GND, 100mV < VOUT < (VDD - 100mV) RL = 25k to VDD/2 RL = 5k to VDD/2 RL = 25k to VDD/2, AOL 105dB RL = 5k to VDD/2, AOL 100dB VOUT = 2.5V, VDD = 5V VCM CMRR VSS-0.3 75 91 VDD-1.1 -- V dB CMRR > 75dB VDD = 5V, VCM = -0.3 to 3.9V IB IB IOS ZCM ZDIFF -- -- -- -- -- 1 -- 1 1013||6 1013||6 -- 80 -- -- -- pA pA pA ||pF ||pF TA= -40C to+85 VOS dVOS/dT PSRR -250 -- 80 -- 1.8 93 +250 -- -- V V/C dB TA= -40C to+85C for VDD = 2.5V to 5.5V SYMBOL MIN. TYP. MAX. UNITS CONDITIONS DC Open Loop Gain AOL 100 118 -- dB OUTPUT Low Level/High Level Output Voltage Swing Linear Region Maximum Output Voltage Swing VOL, VOH VOL, VOH VOUT VOUT Output Short Circuit Current POWER SUPPLY Supply Voltage Quiescent Current Per Amp VS IQ 2.5 -- -- 18.7 5.5 25 V A IO = 0 ISC VSS + 0.015 VSS + 0.045 VSS + 0.050 VSS + 0.100 -- -- -- -- 17 VDD - 0.020 VDD - 0.060 VDD - 0.050 VDD - 0.100 V V V V mA DS11177B-page 2 2000 Microchip Technology Inc. MCP606/607/608/609 AC CHARACTERISTICS Unless otherwise specified, all limits are specified for VDD = +2.5V to +5.5V, VSS = GND, TA = 25 C, VCM = VDD/2, RL = 100k to VDD/2, and VOUT ~ VDD/2 PARAMETERS Gain Bandwidth Product Phase Margin at Unity Crossing Slew Rate Input Voltage Noise Noise Density Input Current Noise Density SYMBOL GBWP MIN. -- -- -- -- -- -- TYP. 155 62 0.08 2.8 38 3 MAX. -- -- -- -- -- -- UNITS kHz V/s Vp-p nV/Hz fA/Hz CONDITIONS VDD = 5V, CL = 60 pf G = 1, VDD = 5V, CL = 60 pf f = 0.1Hz to 10Hz f = 1kHz f = 1kHz SR en en in degrees VDD = 5V, CL = 60 pf SPECIFICATIONS FOR MCP608 CHIP SELECT FEATURE Unless otherwise specified, all limits are specified for VDD = +2.5V to +5.5V, VSS = GND, TA = 25 C, VCM = VDD/2, RL = 100k, and VOUT ~ VDD/2 PARAMETERS CS LOW SPECIFICATIONS CS Logic Threshold, Low CS Input Current, Low CS HIGH SPECIFICATIONS CS Logic Threshold, High CS Input Current, High CS Input High, GND Current Amplifier Output Leakage, CS High DYNAMIC SPECIFICATIONS CS Low to Amplifier Output High Turn-on Time tON -- 9 100 s CS low = 0.2VDD, VOUT = 0.9 *VDD/2, G = +1V/V CS high = 0.8VDD, VOUT = 0.1 *VDD/2, G = +1V/V VDD = 5V VIH ICSH IQ 0.8 VDD -- -- -- -- 0.01 0.05 10 VDD 0.1 0.1 -- V A A nA For entire VDD range CS = VDD CS = VDD CS = 0.8VDD VIL ICSL VSS -0.1 -- 0.01 0.2 VDD -- V A For entire VDD range CS = 0.2VDD SYMBOL MIN. TYP. MAX. UNITS CONDITIONS tOFF CS High to Amplifier Output High Z Hysteresis -- 0.1 -- s -- 0.6 -- V TEMPERATURE SPECIFICATIONS Unless otherwise specified, all limits are specified for VDD = +2.5V to +5.5V, VSS = GND PARAMETERS TEMPERATURE RANGES Specified Temperature Range Operating Temperature Range Storage Temperature Range THERMAL PACKAGE RESISTANCE Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-TSSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP JA JA JA JA JA JA -- -- -- -- -- -- 85 163 124 70 120 100 -- -- -- -- -- -- C/W C/W C/W C/W C/W C/W TA TA TA -40 -40 -65 -- -- -- +85 +85 +150 C C C SYMBOL MIN. TYP. MAX. UNITS CONDITIONS 2000 Microchip Technology Inc. DS11177B-page 3 MCP606/607/608/609 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, TA = 25C, VCM = VDD / 2 and VOUT ~ VDD/2, VSS = GND FIGURE 2-1: Offset Voltage vs. Number of Occurrences with VDD = 5.5V FIGURE 2-4: Offset Voltage Drift vs. Number of Occurrences with VDD = 5.5V FIGURE 2-2: Offset Voltage vs. Number of Occurrences with VDD = 2.5V FIGURE 2-5: Offset Voltage Drift vs. Number of Occurrences with VDD = 2.5V FIGURE 2-3: Quiescent Current vs. Power Supply Voltage vs. Temperature FIGURE 2-6: Quiescent Current vs. Temperature DS11177B-page 4 2000 Microchip Technology Inc. MCP606/607/608/609 Note: Unless otherwise indicated, TA = 25C, VCM = VDD / 2 and VOUT ~ VDD/2, VSS = GND FIGURE 2-7: Normalized Offset Voltage vs. Temperature FIGURE 2-10: Input Offset Voltage vs. Common Mode Voltage FIGURE 2-8: Open Loop Gain, Phase Margin vs. Frequency FIGURE 2-11: Phase Margin, Gain Bandwidth Product vs. Temperature FIGURE 2-9: Phase Margin, Gain Bandwidth, vs. Load Resistance FIGURE 2-12: Input Voltage Noise Density vs. Frequency 2000 Microchip Technology Inc. DS11177B-page 5 MCP606/607/608/609 Note: Unless otherwise indicated, TA = 25C, VCM = VDD / 2 and VOUT ~ VDD/2, VSS = GND FIGURE 2-13: Input Bias Current, Input Offset Current vs. Temperature FIGURE 2-16: Input Bias Current, Input Offset Current vs. Common mode Input Voltage FIGURE 2-14: DC Open Loop Gain vs. Output Load Resistance FIGURE 2-17: DC Open Loop Gain vs. Power Supply Voltage FIGURE 2-15: Common-Mode Rejection Ratio, Power Supply Rejection Ratio vs. Frequency FIGURE 2-18: Common-Mode Rejection Ratio, Power Supply Rejection Ratio vs. Temperature DS11177B-page 6 2000 Microchip Technology Inc. MCP606/607/608/609 Note: Unless otherwise indicated, TA = 25C, VCM = VDD / 2 and VOUT ~ VDD/2, VSS = GND FIGURE 2-19: Low Level and High Level Output Swing vs. Load Resistance FIGURE 2-22: Low Level and High Level output Swing vs. Temperature, RL=5k FIGURE 2-20: Maximum Full Scale Output Voltage Swing vs. Frequency FIGURE 2-23: Low Level and High level Output Swing vs. Temperature, RL=25k FIGURE 2-21: Slew Rate vs. Temperature FIGURE 2-24: Output Short Circuit Current vs. Temperature 2000 Microchip Technology Inc. DS11177B-page 7 MCP606/607/608/609 Note: Unless otherwise indicated, TA = 25C, VCM = VDD / 2 and VOUT ~ VDD/2, VSS = GND FIGURE 2-25: Large Signal Non-inverting Signal Pulse Response FIGURE 2-28: Large Signal Inverting Signal Pulse Response FIGURE 2-26: Small Signal Non-inverting Pulse Response FIGURE 2-29: Small Signal Inverting Signal Pulse Response FIGURE 2-27: Channel to Channel Separation (MCP607 and MCP609 only) FIGURE 2-30: Chip Select to Amplifier Output Response Time (MCP608 only) DS11177B-page 8 2000 Microchip Technology Inc. MCP606/607/608/609 Note: Unless otherwise indicated, TA = 25C, VCM = VDD / 2 and VOUT ~ VDD/2, VSS = GND FIGURE 2-31: CS hysteresis (MCP608 only) 2000 Microchip Technology Inc. DS11177B-page 9 MCP606/607/608/609 3.0 APPLICATIONS INFORMATION The MCP606/607/608/609 family of operational amplifiers are fabricated on Microchip's state-of-the-art CMOS process. They are unity gain stable and suitable for a wide range of general purpose applications. With this family of operational amplifiers, the power supply pin should be by-passed with a 0.1F capacitor. The Linear Region Maximum Output Voltage Swing of the MCP606/607/608/609 family is specified within 50mV from the positive and negative rail with a 25k load and 100mV from the rails with a 5k load. The overriding condition that defines the linear region of the amplifier is the open loop gain that is specified over that region. In the voltage output region between VSS + 50mV and VDD - 50mV, the open loop gain is specified to 105dB (min) with a 25k load. The classical definition of the DC open loop gain of an amplifier is: AOL = 20 log10 (VOUT / VOS) where: AOL is the DC open loop gain of the amplifier, VOUT is equal to (VDD - 50mV) - (VSS+ 50mV) for RL= 25k, and VOS is the change in offset voltage with the changing output voltage of the amplifier. 3.1 Rail-to-Rail Output Swing There are two specifications that describe the output swing capability of the MCP606/607/608/609 family of operational amplifiers. The first specification, Low Level and High Level Output Voltage Swing, defines the absolute maximum swing that can be achieved under specified loaded conditions. For instance, the Low Level Output Voltage Swing of the MCP606/607/ 608/609 family is specified to be able to swing at least to 15mV from the negative rail with a 25k load to VDD/ 2. This output swing performance is shown in Figure 3-1, where the output of an MCP606 is configured in a gain of +2V/V and overdriven with a 4kHz triangle wave. In this figure, the degradation of the output swing linearity is clearly illustrated. This degradation occurs after the point at which the open loop gain of the amplifier is specified and before the amplifier reaches its maximum and minimum output swing. VDD VOH VDD VDD 3.2 Input Voltage and Phase Reversal Since the MCP606/607/608/609 amplifier family is designed with CMOS devices, it does not exhibit phase inversion when the input pins exceed the negative supply voltage. Figure 3-2 shows an input voltage exceeding both supplies with no resulting phase inversion. 9 8 7 6 5 Input Voltage (V) 4 3 2 1 0 0 100 200 VSS 4.9 4.8 VOL VSS VSS 4.7 4.6 4.5 4.4 4.3 4.2 4.1 4 700 300 400 Time (uS) 500 600 Output Voltage (0.1V/div) 10 5 FIGURE 3-1: Swing Low Level and High Level Output The second specification that describes the output swing capability of these amplifiers is the Linear Region Maximum Output Voltage Swing. This specification defines the maximum output swing that can be achieved while the amplifier is still operating in its linear region. FIGURE 3-2: The MCP606/607/608/609 family of op amps do not have phase reversal issues. For this graph, the amplifier is in a gain of +2V/V. DS11177B-page 10 2000 Microchip Technology Inc. MCP606/607/608/609 The maximum operating common-mode voltage that can be applied to the inputs is VSS - 0.3V to VDD - 1.1V. In contrast, the absolute maximum input voltage is VSS - 0.3V and VDD + 0.3V. Voltages on the input that exceed this absolute maximum rating can cause excessive current to flow in or out of the input pins. Current beyond 2mA can cause possible reliability problems. Applications that exceed this rating must be externally limited with an input resistor as shown in Figure 3-3. 80 70 Gain Bandwidth 180 160 Gain-Bandwidth (kHz) 140 120 100 Phase Margin 80 60 VDD = 5V RL=100K 60 Phase Margin() 50 40 30 20 10 0 10 100 Load Capacitance(pF) 40 20 1000 FIGURE 3-4: Gain Bandwidth, Phase Margin vs. Capacitive Load MCP60X RIN VDD RISO RIN = (Maximum expected voltage - VDD) / 2mA or (VSS - Minimum expected voltage)/ 2mA. FIGURE 3-3: If the inputs of the amplifier exceed the Absolute Maximum Specifications, an input resistor, RIN , should be used to limit the current flow into that pin. FIGURE 3-5: Amplifier circuits that can be used when driving heavy capacitive loads. If the amplifier is required to drive larger capacitive loads, the circuit shown in Figure 3-5 can be used. A small series resistor (RISO) at the output of the amplifier improves the phase margin when driving large capacitive loads. This resistor decouples the capacitive load from the amplifier by introducing a zero in the transfer function. This zero adjusts the phase margin by approximately: m = tan-1 (2 GBWP x RISO x CL) where: m is the improvement in phase margin, GBWP is the gain bandwidth product of the amplifier, RISO is the capacitive decoupling resistor, and CL is the load capacitance VIN MCP60X CL VOUT 3.3 Capacitive Load and Stability Driving capacitive loads can cause stability problems with many of the higher speed amplifiers. For any closed loop amplifier circuit, a good rule of thumb is to design for a phase margin that is no less than 45. This is a conservative theoretical value, however, if the phase margin is lower, layout parasitics can degrade the phase margin further causing a truly unstable circuit. A system phase shift of 45 will have an overshoot in its step response of approximately 25%. A buffer configuration with a capacitive load is the most difficult configuration for an amplifier to maintain stability. The Phase versus Capacitive Load of the MCP60X amplifier is shown in Figure 3-4. In this figure, it can be seen that the amplifier has a phase margin above 40, while driving capacitance loads up to 220pF. 2000 Microchip Technology Inc. DS11177B-page 11 MCP606/607/608/609 CS VIL tON Output Hi-Z 18.7A (typ) VDD Supply Current FIGURE 3-6: 50 nA (typ) 18.7A (typ) 50 nA (typ) VIH tOFF Hi-Z Timing Diagram for the CS Function of the MCP608 Amplifier 3.4 The Chip Select Option of the MCP608 The MCP608 is a single amplifier with a Chip Select option. When CS is pulled high the supply current drops to 50 nA (typ). In this state, the amplifier is put into a high impedance state. By pulling CS low, the amplifier is enabled. If the CS pin is left floating, the amplifier will not operate properly. Figure 3-6 shows the output voltage and supply current response to a CS pulse. -In +In V- 3.5 Layout Considerations Guard Ring FIGURE 3-7: Example of Guard Ring for the MCP606, the A-amplifier of the MCP607 or the MCP608 in a PC Board Layout Circuit examples of ring implementations are shown in Figure 3-8. In Figure 3-8A, B and C, the guard ring is biased to the common-mode voltage of the amplifier. This type of guard ring is most effective for applications where the common-mode voltage of the input stage changes, such as buffers, non-inverting gain amplifiers or instrumentation amplifiers. The strategy shown in Figure 3-8D, biases the common-mode voltage and guard ring to ground. This type of guard ring is typically used in precision photo sensing circuits. In applications where low input bias current is critical, PC board surface leakage effects and signal coupling from trace to trace need to be taken into consideration. 3.5.1 SURFACE LEAKAGE Surface leakage across a PC board is a consequence of differing DC voltages between two traces combined with high humidity, dust or contamination on the board. For instance, the typical resistance from PC board trace to pad is approximately 1012 under low humidity conditions. If an adjacent trace is biased to 5V and the input pin of the amplifier is biased at or near zero volts, a 5pA leakage current will appear on the amplifier's input node. This type of PCB leakage is five times the room temperature input bias current (1pA, typ) of the MCP606/607/608/609 family of amplifiers. The simplest technique that can be used to reduce the effects of PC board leakage is to design a ring around sensitive pins and traces. An example of this type of layout is shown in Figure 3-7. DS11177B-page 12 2000 Microchip Technology Inc. MCP606/607/608/609 3.5.2 Figure 3-8A The input pins of the MCP606/607/608/609 amplifiers have a high impedance providing an opportunity for noise injection, if layout issues are not considered. These high impedance input terminals are sensitive to injected currents. This can occur if the trace from a high impedance input is next to a trace that has fast changing voltages, such as a digital or clock signal. When a high impedance trace is in close proximity to a trace with these types of voltage changes, charge is capacitively coupled into the high impedance trace. C= w x L x eo x er d pF PCB Trace SIGNAL COUPLING MCP60X Figure 3-8B d MCP60X L Figure 3-8C w (typ 0.003mm) w= thickness of PCB trace PCB Cross-Section L= length of PCB trace d= distance between the two PCB traces MCP60X Voltage Reference (could be ground) FIGURE 3-9: Capacitors can be built with PCB traces allowing for coupling of signals from one trace to another. As shown in Figure 3-9, the value of the capacitance between two traces is primarily dependent on the distance (d) between the traces and the distance that the two traces are in parallel (L). From this model, the amount of current generated into the high impedance trace is equal to: I = C V/t where: I equals the current that appears on the high impedance trace, Figure 3-8D VDD MCP60X FIGURE 3-8: Examples of how to design PC Board traces to minimize leakage paths to the high impedance input pins of the MCP606/607/608/609 amplifiers. C equals the value of capacitance between the two PCB traces, V equals the change in voltage of the trace that is switching, and t equals the amount of time that the voltage change took to get from one level to the next. 2000 Microchip Technology Inc. DS11177B-page 13 MCP606/607/608/609 3.6 3.6.1 Typical Applications LOW SIDE BATTERY CURRENT SENSING speed sensing. This is done by reverse biasing the photodetector, which reduces the parasitic capacitance of the diode. The key specifications that influence the accuracy of these circuits are low offset voltage, low input bias current, high input impedance and an input common mode range below ground. The low input offset voltage and low input bias current provide an environment where there is minimal voltage placed across the photodetector, consequently the linearity of the photodetector is not compromised. Given that the MCP606/607/608/ 609 amplifiers are specified for a 250V(max) offset voltage and input bias currents in the pico ampere region they are ideal for these circuits. Additionally, these two circuits will only work if the common-mode range of the amplifier includes zero, which is the case with the MCP606/607/608/609 amplifiers. C2 R2 D1 50k VDD RF VDD The MCP606/607/608/609 amplifiers can be used to sense the output current on the low side of a battery using the circuit in Figure 3-10. In this circuit, the current from the power supply (minus the current required to power the MCP606) flows through a ten ohm resistor from the rest of the circuit in the system. This current is converted to a voltage through the sense resistor and gained by the resistors around the amplifier. Since the input bias current and offset voltage of the MCP606 is low, there is very little error generated by the amplifier. Additionally, the amplifier is capable of swinging below ground and the quiescent current is very low. These four specifications make this amplifier appropriate for this type of circuit. I LOAD R SENSE ---------------------------------------------RF 1 + ---------R IN VDD ID1 * MCP606 Light VOUT +2.5 to 5.5V 5k RIN MCP606 VSS VSS To load VBIAS D1 R2 VDD * MCP606 10 Light ID1 VOUT FIGURE 3-10: Low Side Battery Current Sensing 3.6.2 PREAMPLIFIER FOR PHOTO DETECTION CIRCUIT VOUT = R2 ID1 *Bypass Capacitor, 1F Any amplifier from this family of operational amplifiers can be used to convert an output current signal from a sensor into a voltage. A sensor that fits this description is a photodetector as shown in Figure 3-11. This type of circuit is implemented with a single resistor and an optional capacitor in the feedback loop of the amplifier. As light impinges on the photo diode, charge is generated, causing a current to flow in the reverse bias direction of the photodetector. Two circuits are shown in Figure 3-11. The top circuit is designed to provide precision sensing from the photodetector. In this circuit the voltage across the detector is nearly zero and equal to the offset voltage of the amplifier. With this configuration, current that appears across the resistor, R2, is primarily a result of the light excitation on the photodetector. The photosensing circuit on the bottom of Figure 3-11 is designed for higher FIGURE 3-11: Pre-Amplifier for Photo Detection Circuit DS11177B-page 14 2000 Microchip Technology Inc. MCP606/607/608/609 3.6.3 TWO OP-AMP INSTRUMENTATION AMPLIFIER V2 1 /2 VS * R3 R4 VDD R2 RG R2 R3 R4 VREF 1 /2 The two op-amp instrumentation amplifier shown in Figure 3-12 serves the function of taking the difference of two input voltages, level shifting then and providing a single output. This configuration is best suited for higher gains. (gain > 3 V/V) is shown in Figure 3-12. The key specifications that make the MCP606/607/ 608/609 family appropriate for this application circuit is low input bias current, low offset voltage and high common-mode rejection. The reference voltage of this circuit is supplied to the first op amp in the signal chain. Typically, this voltage is half of the supply voltage in a single supply environment. RG R1 VREF 1 /2 MCP607 * VOUT MCP607 1 /2 V1 MCP607 R4 2R 2 R 4 VOUT = (V 1 -V 2 ) + ---------- ------ + V REF ------ 1 R 3 R G R 3 *Bypass Capacitor, 1F R2 VDD * R2 R1 FIGURE 3-13: Three Op-Amp Instrumentation Amplifier 3.6.5 PRECISION GAIN WITH GOOD LOAD ISOLATION MCP607 V2 V1 1 /2 MCP607 VOUT R 1 2R 1 VOUT = ( V 1 - V 2 ) 1 + ------ + ---------- + V REF R2 RG *Bypass Capacitor, 0.1F FIGURE 3-12: Two Op-Amp Instrumentation Amplifier 3.6.4 THREE OP-AMP INSTRUMENTATION AMPLIFIER In Figure 3-14, the low input offset voltage of the MCP606 is used to implement a circuit with a high gain. This precision measurement can easily be disrupted by changing the output current drive of the device that is doing the amplification work. Consequently the precision amplifier configuration is followed by a MCP601 amplifier which is capable of driving higher currents. Since the two amplifiers are housed in separate packages, there is minimal change in offset voltage of the MCP606 due to loading effects. R1 R2 VS VDD - MCP606 A classic, three op amp instrumentation amplifier is illustrated in Figure 3-15. The input operational amplifiers in this circuit provide signal gain. The output operational amplifier converts the signal from two inputs to a single ended output with a difference amplifier. The gain of this circuit is simply adjusted with one resistor, RG. The reference voltage of the difference stage of this instrumentation amplifier is capable of spanning a wide range. Most typically this node is referenced to half of the supply voltage in a signal supply application. - * VOUT * MCP601 + VIN + Buffer Precision Amplifier *Bypass Capacitor, 1F FIGURE 3-14: Precision Gain with Good Load Isolation 2000 Microchip Technology Inc. DS11177B-page 15 MCP606/607/608/609 4.0 SPICE MACROMODEL The Spice macromodel for the MCP606, MCP607, MCP608 and MCP609 simulates the typical amplifier performance of offset voltage, DC power supply rejection, input capacitance, DC common mode rejection ratio, open loop gain over frequency, phase margin with no capacitive load, output swing, DC power supply current, power supply current change with supply voltage, input common mode range and input voltage noise. The characteristics of the MCP606, MCP607, MCP608, and MCP609 amplifiers are similar in terms of performance and behavior. This single op amp macromodel supports all four devices with the exception of the chip select function of the MCP608, which is not modeled. The listing for this macromodel is shown on the next page. The most recent revision of the model can be downloaded from Microchip's web site at www.microchip.com. DS11177B-page 16 2000 Microchip Technology Inc. MCP606/607/608/609 Software License Agreement The software supplied herewith by Microchip Technology Incorporated (the "Company") for its PICmicro(R) Microcontroller is intended and supplied to you, the Company's customer, for use solely and exclusively on Microchip PICmicro Microcontroller products. The software is owned by the Company and/or its supplier, and is protected under applicable copyright laws. All rights are reserved. Any use in violation of the foregoing restrictions may subject the user to criminal sanctions under applicable laws, as well as to civil liability for the breach of the terms and conditions of this license. THIS SOFTWARE IS PROVIDED IN AN "AS IS" CONDITION. NO WARRANTIES, WHETHER EXPRESS, IMPLIED OR STATUTORY, INCLUDING, BUT NOT LIMITED TO, IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE APPLY TO THIS SOFTWARE. THE COMPANY SHALL NOT, IN ANY CIRCUMSTANCES, BE LIABLE FOR SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, FOR ANY REASON WHATSOEVER. .subckt MCP606 1 2 3 4 5 * ||||| * | | | | Output * | | | Negative supply * | | Positive Supply * | Inverting input * Non-inverting input * * Macromodel for MCP606 (single), MCP607 (dual), MCP608 (single w/CS), and MCP609 (quad) * * The characteristics of the MCP606, MCP607, MCP608, and MCP609 have the same fundamental * performance and behavior. Consequently, this single op amp macromodel supports all four * devices. However, the chip select function of the MCP608 is not modeled. * * Revision History: * REV A : 6-30-99 created BCB * * This macromodel models typical amplifier offset voltage, DC power supply rejection, input * capacitance, open loop gain over frequency, phase margin with 60pF load, output swing, * power supply current, input voltage noise, slew rate. * * NOTICE: THE INFORMATION PROVIDED HEREIN IS BELIEVED TO BE RELIABLE, * HOWEVER, MICROCHIP ASSUMES NO RESPONSIBILITY FOR INACCURACIES OR * OMISSIONS. MICROCHIP ASSUMES NO RESPONSIBILITY FOR THE USE OF THIS * INFORMATION, AND ALL USE OF SUCH INFORMATION SHALL BE ENTIRELY AT * THE USER'S OWN RISK. NO INTELLECTURAL PROPERTY RIGHTS OR LICENSES * TO ANY OF THE TECNOLOGY DESCRIBED HEREIN ARE IMPLIED OR GRANTED TO * ANY THIRD PARTY. MICROCHIP RESERVES THE RIGHT TO CHANGE THIS MODEL * AT ANY TIME WITHOUT NOTICE. * * *Input Stage, pole at 300kHz M1 9 64 7 3 Ptype M2 8 2 7 3 Ptype CDIFF 1 2 3E-12 CCM1 1 4 6E-12 CCM2 2 4 6E-12 IDD 3 7 13.33e-6 RA 8 6 1.839e3 RB 9 6 1.839e3 CA 8 9 125e-12 ICOMP 3 4 -194.63e-6 *Input Stage Common-Mode Clampling VCMM 4 6 0.35 ECM 55 4 3 64 1 RCM DCMP VCMP RST DST 57 56 57 58 59 56 55 4 59 55 1E3 DY 1.2 1E3 DX 2000 Microchip Technology Inc. DS11177B-page 17 MCP606/607/608/609 VST GCMP2 58 4 1.6 23 4 POLY(2) 57 56 58 59 0 0 0;0 -0.5E-3 0.5E-3 *Input errors (vos, en, psr) ERR 64 1 poly(2) (67,4) (3, 4) -229.9e-6 1 23e-6 *Second GS R1 C2 VSOM VSOP DSOM DSOP *HCM Stage, pole at 0.183Hz 23 4 8 9 23 4 8.2144e9 23 4 110e-12 3 25 23 25 23 24 4 24 23 3 4.784 -3.98 DY DY VCMP 543.78e-6 FS 3 4 POLY(11) VO3 VO5 VO4 VO6 VO1 VO2 VO9 VO10 VMID1 VSOP VSOM + 200E-6 -1 -1 -1 1 -1 -1 1 1 -1 -1 -1 *mid-supply reference RMID1 3 35 VMID1 35 34 RMID2 4 34 ELEVEL 34 4 *output DO3 DO4 DO5 DO6 DO7 DO8 VO3 VO4 GO5 VO5 GO6 VO6 GO1 VO1 GO2 VO2 RO9 VO9 RO10 VO10 * input VN1 DN1 RN1 stage 34 44 3 3 4 4 43 5 3 47 4 48 49 49 50 50 3 51 52 52 61.62E3 0 61.62E3 23 4 -1 43 34 45 46 45 46 5 44 47 5 48 5 4 45 4 46 51 5 4 5 DY DY DY DY DY DY 0.1 0.03 3 0 34 0 5 0 34 0 100 0 100 0 34 4 34 10E-3 10E-3 10E-3 5 10E-3 voltage noise 65 4 65 67 67 4 0.6 DX 10E3 .model Ptype PMOS L=2 W=105 .model DY D (IS=1e-15 BV =50) .model DX D (IS=1e-18 AF=0.6 KF=10e-17) .ENDS DS11177B-page 18 2000 Microchip Technology Inc. MCP606/607/608/609 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example MCP606 XXXXXNNN 0025 8-Lead SOIC (208 mil) XXXXXXX XXXYYWW NNN Example MCP606 XXX0025 NNN 8-Lead TSSOP XXXX YYWW NNN Example XXXX 0025 NNN Legend: XX...X YY WW NNN Note: Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2000 Microchip Technology Inc. DS11177B-page 19 MCP606/607/608/609 Package Marking Information (Continued) 14-Lead PDIP (300 mil) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example MCP606 XXXXXXXXXXXXXX 0025NNN 14-Lead SOIC (208 mil) XXXXXXXXXX YYWWNNN Example MCP606 0025NNN 14-Lead TSSOP XXXXXX YYWW NNN Example XXXXXX YYWW NNN Legend: XX...X YY WW NNN Note: Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. DS11177B-page 20 2000 Microchip Technology Inc. MCP606/607/608/609 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2000 Microchip Technology Inc. DS11177B-page 21 MCP606/607/608/609 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS11177B-page 22 2000 Microchip Technology Inc. MCP606/607/608/609 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E E1 p D 2 1 n B A c L A1 A2 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B MIN INCHES NOM 8 .026 MAX MIN .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 2000 Microchip Technology Inc. DS11177B-page 23 MCP606/607/608/609 14-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c A1 eB B1 B p L Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .740 .750 .760 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing .310 .370 .430 Mold Draft Angle Top 5 10 15 5 10 15 Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005 Units Dimension Limits n p MIN INCHES* NOM 14 .100 .155 .130 MAX MIN MILLIMETERS NOM 14 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15 DS11177B-page 24 2000 Microchip Technology Inc. MCP606/607/608/609 14-Lead Plastic Small Outline (SL) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .150 .337 .010 .016 0 .008 .014 0 0 INCHES* NOM 14 .050 .061 .056 .007 .236 .154 .342 .015 .033 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .347 .020 .050 8 .010 .020 15 15 MILLIMETERS NOM 14 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0 4 0.20 0.23 0.36 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065 2000 Microchip Technology Inc. DS11177B-page 25 MCP606/607/608/609 14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E E1 p D 2 n B 1 A c L A1 A2 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 MIN INCHES NOM 14 .026 .035 .004 .251 .173 .197 .024 4 .006 .010 5 5 MAX MIN .033 .002 .246 .169 .193 .020 0 .004 .007 0 0 .043 .037 .006 .256 .177 .201 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 14 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087 DS11177B-page 26 2000 Microchip Technology Inc. MCP606/607/608/609 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. Systems Information and Upgrade Hot Line The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-786-7302 for the rest of the world. 991103 Connecting to the Microchip Internet Web Site The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events Trademarks: The Microchip name, logo, PIC, PICmicro, PICSTART, PICMASTER, PRO MATE and MPLAB are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FlexROM and fuzzyLAB are trademarks and SQTP is a service mark of Microchip in the U.S.A. All other trademarks mentioned herein are the property of their respective companies. 2000 Microchip Technology Inc. DS11177B-page 27 MCP606/607/608/609 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 786-7578. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: RE: Technical Publications Manager Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS11177B FAX: (______) _________ - _________ Device: MCP606/607/608/609 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS11177B-page 28 2000 Microchip Technology Inc. MCP606/607/608/609 NOTES: 2000 Microchip Technology Inc. DS11177B-page 29 MCP606/607/608/609 NOTES: DS11177B-page 30 2000 Microchip Technology Inc. MCP606/607/608/609 MCP606/607/608/609 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Part Number X /X P SN SL ST = = = = Plastic DIP (300 mil Body), 8-lead and 14-lead Plastic SOIC (150 mil Body), 8-lead Plastic SOIC (150 mil Body), 14-lead Plastic TSSOP, 8-lead and 14-lead Package: Temperature Range: I = -40C to +85C Device: MCP606 MCP606T MCP607 MCP607T MCP608 MCP608T Single Operational Amplifier Single Operational Amplifier (Tape and Reel-SOIC/TSSOP) Dual Operational Amplifier Dual Operational Amplifier (Tape and Reel-SOIC/TSSOP) Single Operational Amplifier w/CS Function Single Operational Amplifier w/CS Function (Tape and Reel-SOIC/TSSOP) MCP609 = Quad Operational Amplifier MCP609T = Quad Operational Amplifier (Tape and Reel-SOIC/TSSOP) = = = = = = Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 786-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2000 Microchip Technology Inc. DS11177B-page 31 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-786-7200 Fax: 480-786-7277 Technical Support: 480-786-7627 Web Address: http://www.microchip.com AMERICAS (continued) Toronto Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253 ASIA/PACIFIC (continued) Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-334-8870 Fax: 65-334-8850 ASIA/PACIFIC China - Beijing Microchip Technology, Beijing Unit 915, 6 Chaoyangmen Bei Dajie Dong Erhuan Road, Dongcheng District New China Hong Kong Manhattan Building Beijing, 100027, P.R.C. Tel: 86-10-85282100 Fax: 86-10-85282104 Taiwan Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Atlanta Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston Microchip Technology Inc. 2 LAN Drive, Suite 120 Westford, MA 01886 Tel: 508-480-9990 Fax: 508-480-8575 EUROPE Denmark Microchip Technology Denmark ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 China - Shanghai Microchip Technology Unit B701, Far East International Plaza, No. 317, Xianxia Road Shanghai, 200051, P.R.C. Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Chicago Microchip Technology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Hong Kong Microchip Asia Pacific Unit 2101, Tower 2 Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431 France Arizona Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Dallas Microchip Technology Inc. 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 India Microchip Technology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore, 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062 Germany Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Munchen, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Dayton Microchip Technology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175 Italy Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Detroit Microchip Technology Inc. Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Japan Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Los Angeles Microchip Technology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5858 Fax: 44-118 921-5835 05/16/00 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934 New York Microchip Technology Inc. 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. All rights reserved. (c) 2000 Microchip Technology Incorporated. Printed in the USA. 7/00 Printed on recycled paper. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. DS11177B-page 32 2000 Microchip Technology Inc. |
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